Date:
April 29 - May 2, 2002
Location: San Jose, CA
Event Web Site: http://www.mdronline.com/epf/index.htm  

 

 


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At the 2002 Embedded Processor Forum, Systemonic's CTO, Gerhard Fettweis, gave a presentation on Systemonic's advanced 802.11 a+b multi-mode wireless LAN combo chip-set with embedded DSP.

 

OnDSP™: A New Architecture for Wireless LAN Applications

Systemonic’s OnDSP™, with its leading-edge hardware architecture and ISA, is the enabler for designing a highly competitive IEEE 802.11 a+b multi-mode wireless LAN combo chip-set with embedded DSP. The physical layer adapts to RF and channel impairments and its flexibility enables it to address future enhancements as the standardization process spins-out. For benchmarks (such as 3GPP) a factor of 10x can be achieved in processing power over today’s standard DSPs. Clearly, this shows that OnDSP is a new platform that is changing the mode of design and is the answer for developing future embedded communications solutions quickly and effectively.

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