NEW SYSTEMONIC DSP CHIP DRAMATICALLY REDUCES COST AND TIME-TO-MARKET

M3 DSP WORKING PROTOTYPE SET TO GIVE DRESDEN COMPANY MAJOR COMPETITIVE ADVANTAGE IN EMERGING MARKETPLACES


London, Dresden - June 29th, 2000 - Systemonic, the Dresden-based wireless communication chip company, has announced that it has demonstrated working prototypes of its platform-based next generation DSP (Digital Signal Processor). The prototype, project-named M3, realises Systemonic´s new proprietary architecture which, it is claimed, reduces time-to-market of chip design and build to a third of traditional methods and costs to less than half.

Systemonic is achieving this by using a new DSP automated design methodology which allows the highly efficient design of application specific DSPs in a very short development time. This flexibility and the underlying architecture allows the chip to operate in areas and applications currently outside the remit of conventional hardwired solutions.

Systemonic´s CEO commented: "M3´s flexibility and reduced time-to-market will give Systemonic significant competitive advantage, particularly with the fast emergence of new broadband wireless communications standards. Our DSP methodology will allow us to hit new marketplaces hard and fast, enabling wireless electronic communication to become the everyday norm."

Research conducted by Micro Logic Research forecasts that the total wireless semiconductor market will grow from $5 billion in 1999 to $19 billion in 2004.

Dr. Michael Bolle, Co-founder and Vice President of Engineering at Systemonic, added: "We are excited to have achieved first-time working silicon which shows a sustained performance of 900 MOpS (Million Operations per second), clearly demonstrating the chip´s potential. It is already receiving high levels of interest from the customer marketplace."

Systemonic currently employs over 30 electronics and computer science experts and plans to double this over the next two years. The company is currently working on the first commercial application of its next generation DSP technology and expects to be shipping chipsets in Quarter 1, 2001.

About Systemonic
Systemonic is a wireless communications platform provider that delivers complete Silicon System Solutions that power wireless data, video and voice networks across standards, across the world. Its flexible, re-configurable platform allows customers to bring wireless communications products that support multiple standards to market faster, with more features, lower power consumption and at a lower total cost of ownership.

In November 2000, Systemonic completed second round funding of USD 30 million from an investment consortium led by Atlas Venture and APAX Europe IV, including, Krone mt, and Lehman Brothers.

Systemonic was founded in 1999 after four years of research at the University of Dresden.

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